BACKPLANE FABRICATION
Viasystems’ vast experience in midplane and backplane
technology in our former western world PCB operations has allowed
us to rapidly develop our technical capabilities to be one of
the most technically advanced, largest volume operations in
the world. Here is a brief summary of our capabilities:
 |
Layer count 50+ |
| Panel size capability up to 50"x24", 1270x610mm |
| Maximum Thickness 0.400", 10mm |
| Aspect Ratio 15:1 |
| Impedance Control single & differential lines |
| Blind vias / depth controlled drilled |
| Backdrilling multiple depths from both sides |
| Standard FR4 to low loss material and hybrids |
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