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MIDPLANES AND BACKPLANES

Industry-Leading Capability

Viasystems has vast experience in midplane and backplane technology, and we are the world’s most technically advanced and largest-volume backplane provider in the world. Our technologically advanced, two million square foot facility in Guangzhou, China, has extensive experience with large panel sizes, high aspect ratios, high layer count and very thick boards. Here is a brief summary of our midplane and backplane capabilities.

MIDPLANES & BACKPLANES
Midplanes & Backplanes Layer count: up to 60
Panel size capability: 28" x 49"
Maximum Thickness: 0.365" nominal (9.125 mm)
Aspect Ratio: 16:1
Impedance Control single and differential lines
Blind vias / depth controlled drilled
Backdrilling multiple depths from both sides
Standard FR4 to low-loss material and hybrids