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THERMAL MANAGEMENT AND RF

Wide Range of Solutions for Top Performance

Viasystems’ thermal management solutions include our patented embedded E-Coin technology along with heat sink coin attachment capabilities and heavy copper. Our expertise in RF/Microwave is unmatched in the industry.

Learn more about our thermal management approaches.  The documents in this section explain how our high frequency construction techniques and methods improve performance. 

Viasystems E-Coin: Embedded Copper Technology
Press-Fit Coin Technology: General Design Guidelines
Press-Fit Coin Technology: Overview
Castellated Holes: Design for Manufacturing Guide