THERMAL MANAGEMENT AND RF
Wide Range of Solutions for Top Performance
Viasystems’ thermal management solutions include our patented embedded E-Coin technology along with heat sink coin attachment capabilities and heavy copper. Our expertise in RF/Microwave is unmatched in the industry.
Learn more about our thermal management approaches. The documents in this section explain how our high frequency construction techniques and methods improve performance.
Viasystems E-Coin: Embedded Copper Technology
Press-Fit Coin Technology: General Design Guidelines
Press-Fit Coin Technology: Overview
Castellated Holes: Design for Manufacturing Guide